163 lines
3.4 KiB
Plaintext
163 lines
3.4 KiB
Plaintext
{
|
|
"Header": {
|
|
"GenerationSoftware": {
|
|
"Vendor": "KiCad",
|
|
"Application": "Pcbnew",
|
|
"Version": "(5.99.0-8910-g624a231cc0)"
|
|
},
|
|
"CreationDate": "2021-03-02T10:35:16+01:00"
|
|
},
|
|
"GeneralSpecs": {
|
|
"ProjectId": {
|
|
"Name": "MainBoard",
|
|
"GUID": "4d61696e-426f-4617-9264-2e6b69636164",
|
|
"Revision": "rev?"
|
|
},
|
|
"Size": {
|
|
"X": 55.75,
|
|
"Y": 70.75
|
|
},
|
|
"LayerNumber": 4,
|
|
"BoardThickness": 1.0,
|
|
"Finish": "None"
|
|
},
|
|
"DesignRules": [
|
|
{
|
|
"Layers": "Outer",
|
|
"PadToPad": 0.1,
|
|
"PadToTrack": 0.1,
|
|
"TrackToTrack": 0.13,
|
|
"MinLineWidth": 0.13,
|
|
"TrackToRegion": 0.2,
|
|
"RegionToRegion": 0.2
|
|
},
|
|
{
|
|
"Layers": "Inner",
|
|
"PadToPad": 0.0,
|
|
"PadToTrack": 0.0,
|
|
"TrackToTrack": 0.13,
|
|
"MinLineWidth": 0.2,
|
|
"TrackToRegion": 0.2,
|
|
"RegionToRegion": 0.2
|
|
}
|
|
],
|
|
"FilesAttributes": [
|
|
{
|
|
"Path": "MainBoard-F_Cu.gbr",
|
|
"FileFunction": "Copper,L1,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "MainBoard-In1_Cu.gbr",
|
|
"FileFunction": "Copper,L2,Inr",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "MainBoard-In2_Cu.gbr",
|
|
"FileFunction": "Copper,L3,Inr",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "MainBoard-B_Cu.gbr",
|
|
"FileFunction": "Copper,L4,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "MainBoard-F_Silkscreen.gbr",
|
|
"FileFunction": "Legend,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "MainBoard-B_Silkscreen.gbr",
|
|
"FileFunction": "Legend,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "MainBoard-F_Mask.gbr",
|
|
"FileFunction": "SolderMask,Top",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "MainBoard-B_Mask.gbr",
|
|
"FileFunction": "SolderMask,Bot",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "MainBoard-Edge_Cuts.gbr",
|
|
"FileFunction": "Profile",
|
|
"FilePolarity": "Positive"
|
|
}
|
|
],
|
|
"MaterialStackup": [
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Top Silk Screen"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Top Solder Paste"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Color": "Green",
|
|
"Thickness": 0.01,
|
|
"Name": "Top Solder Mask"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "F.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 0.1,
|
|
"Material": "FR4",
|
|
"Name": "F.Cu/In1.Cu",
|
|
"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.0175,
|
|
"Name": "In1.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 0.665,
|
|
"Material": "FR4",
|
|
"Name": "In1.Cu/In2.Cu",
|
|
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.0175,
|
|
"Name": "In2.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 0.1,
|
|
"Material": "FR4",
|
|
"Name": "In2.Cu/B.Cu",
|
|
"Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "B.Cu"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Color": "Green",
|
|
"Thickness": 0.01,
|
|
"Name": "Bottom Solder Mask"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Bottom Solder Paste"
|
|
},
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Bottom Silk Screen"
|
|
}
|
|
]
|
|
}
|